Qualcomm Taiwan Internship Program

Where mobility’s future intersects with yours.

You and mobile technology have something in common. You’re both going places that can change the world for the better and help bring the future here faster. And we think Qualcomm is the perfect place for you two to meet.

Yes, “change the world” is part of the job description.

A career at Qualcomm gives you the opportunity to join in the creation of technologies that change the world. Thousands of dedicated people working diligently to make a mark in the evolution of our planet. Sounds like a pretty big deal to just start with a simple job application. But it does.

Advancing engineering and business operations in Asia.

Our offices in Taiwan promote the effective exchange of technology and foster collaborative development across the industry. We use our technical expertise and localized service to drive new applications and boost the development of Taiwan’s semiconductor industry.

Qualifications

Able to commit at least 3 months internship and work 20 hours per week.
Prefer students in final year, eligible to work as full-time employee starting summer 2019.
Mandarin and English well speaking required.
Excellent written and verbal communication skills in English and Mandarin.

1.Product Test Engineering

Electrical Engineering/Computer Engineering

I. Apply DFT strategies, design principles, and test concepts into real world semiconductor applications.
II. Training:DOEs and data analysis on large volume production data with the goal of correlating findings back to pre-silicon simulations. 

Qualifications:
∙ Applicable course work: Digital Logic, Computer Architecture, VLSI design, Semi-Conductor Physics, Statistics, Programming Language (C++, JAVA, Python, VB) , Digital Communications, Wireless Communications.
∙ Advanced course work: DFT and Fault Modeling, Machine Learning Algorithms, RF Measurement Methods.
∙ Have strong analytical/problem solving skills and good organizational skills.

2.Characterization Engineer

Physics/Electrical Engineering/Other Physical Science

This position requires ability to understand device operation, device testing, and the basics of device fabrication processes. This person will work closely with device designers, Test Engineers and Process Integrators in Asia and the USA. He or she will evaluate device failures, analyze test yields, correlate device defects to process steps, and find root cause of failures by applying appropriate Failure Analysis techniques. In addition he or she will assist in yield improvements by proposing process changes to eliminate the root cause of failure and Characterization analysis.

I. Data mining with suppliers, vendors and manufactured sites for yield interphase.
II. Work between sensor integration and test teams to solve problems at module assembler and final customer
III. Need to work for test specification define for new product
IV. Need to be on site support customer to build new product
V. Need to work with customer for testing and tuning at the initial stage of product design.


Qualifications:
∙ This person must communicate well in Mandarin and English.
∙ Device physics
∙ Electrical physics
∙ Model Simulation
∙ Data mining skill is required
∙ Deep understanding TFT and Analog design is plus
∙ Computer skills: MS Office, Visual Basic, JMP, C++ or MATLAB
∙ Able to commit at least 3 months internship and work 20 hours per week.
∙ Prefer students in final year, eligible to work as full-time employee starting summer 2019.
∙ Master student in Physics, Electrical Engineering, or other physical science. Mandarin and English well speaking required.

3.Finger Print Process Engineer

Material Engineering/Physics/Physical Chemist/Chemical Engineering/Other Material Science

I. Process Engineer for cell phone modules, fingerprint sensors or other sensor devices for mobile cell phone and tablet applications.
II. Evaluate device failures, analyze test yields, correlate device defects to process steps, and find root cause of failures by applying appropriate failure analysis and process development techniques.
III. Yield improvements by proposing process changes to eliminate the root cause of failure and characterization analysis.
IV. Close work with supplier and manage the supply chain quality.
V. work for customer return.
VI. IQC/OQC Failure Analysis for yield improvement.

Qualifications:
∙ Material Engineering, Device Physics, Failure Analysis Techniques such as: Optical Microscopy, Cross Sectioning, SEM, FIB/SEM, AES, FTIR, XPS, SAM, etc. Deep understanding TFT and CMOS device is plus Computer skills: MS Office, Visual Basic, MATLAB.
∙ Understand device operation, device testing, and the basics of device fabrication processes.

4.Test Engineer

Material Engineering/Physics

I. Process technology foundry interface team responsible for the next generation technology development and bring-up.
II. Training by experienced characterization engineer to generate test code, debug hardware/software issues, and support RF test structures layout.

Qualifications:
∙ Good academic foundation in MOSFET and bipolar device physics.
∙ Strong analytical and problem solving skills and be fluent in English, both verbal and written.

6.Reliability Engineering

Electrical Engineering/Computer Engineering

I. You will be expected to learn the product level reliability evaluation for leading edge silicon process technology on mobile products includes application processor, modem, power management and RF devices.
II. You will focus on learning how develop and execute reliability evaluation of the complex products to gain valuable insight that can further their interest in your chosen career field.
III. Work with cross functional talented engineers worldwide within QUALCOMM’s organization.
IV. Familiar with Reliability evaluation strategy, learn JEDEC, AEC-Q100 specification Learn and familiar with CMOS process technologies and Silicon device package technologies.
V. Learn and familiar with statistical analysis (Weibull, lognormal), sampling plan, statistical process control (SPC), FMEA and Reliability tools/software. Familiar and learn reliability equipment, HTOL oven, ESD machine, Temp Cycle, Humidity/Bias chambers etc.
VI. Develop High Temp Operating Life (HTOL) circuit bias condition Develop ESD and Latch-up test plan and coordinate with lab Work with Product Test Engineer to develop and debug HTOL vector on state of art HTOL oven/pre-screen station Involve with data analysis on pre/post ATE test Assist in preparing information and research materials Manage Reliability databases and input information, data, and records Attend company functions and networking events.

Qualifications:
∙ Specialized in Circuit design, Silicon process, Device physics. Basic understanding of statistics, software familiar with Minitab or JUMP.
∙ Proficient computer skills, including Microsoft Office Suite (Word, PowerPoint, and Excel)
∙ Self-directed and able to work without supervision.
∙ Energetic and eager to tackle new projects and ideas.

9.RMA Engineer (Return Materials Authorization)

Electronics/Electrical Engineering/Computer Engineering

I. Be involved in RMA product quality issue resolution for the latest mobile and finger print products.
II. Assigned products in support of RMA evaluation requests issued by QUALCOMM’s customers.
III. Defect correlation will be achieved via system and device level evaluation techniques utilizing a variety of fault isolation and debug tools such as ATE, XRAY, CSAM, IV curve, bench, mobile testing platform and others.
IV. A full-time employment may be possible at the end of the internship.

Qualifications:
∙ A local university student in electronics or physic major.
∙ Understanding of semiconductor physics.
∙ Programs skills in C++, Perl, and/or VBA.
∙ Knowledge of Use of bench equipment (e.g. oscilloscope).
∙ Fast learner with enthusiasm and interest in test development engineering and wireless communications.
∙ Goal oriented and results driven.
∙ Mobile Systems Knowledge: i.e. Understanding of the key components of the individual subsystems in a mobile phone and how they are expected to interact.

11.Spice Model Engineer

Electrical Engineering/Physics

This opening is for an intern, who will be working with a Spice Model Group located in San Diego, USA, on Spice Models for state-of-the art Logic CMOS, advanced RF CMOS and latest PMIC technologies, working with leading edge semiconductor foundries, to meet Qualcomm's advanced product roadmap requirements in Digital, RF, PMIC, Mobile, computing, Connectivity, Automotive, IOT, and Artificial Intelligence, etc. Candidate will be supporting the San Diego Spice Modeling Team on advanced SPICE model Quality Assurance (QA), model-silicon verification, test structure targets generation, Critical Parameters List (CPL) generation, as well as cross-technology performance benchmarking, etc. Internship tasks and goal ( ~6months)
I. Support Spice model simulation tasks for Logic, RF, PMIC, technologies.
II. Support San Diego Spice Model team, on test structure targets generation, CPL targets simulation and generation
III. Support San Diego Spice team to complete model Benchmark simulations across multiple-technology nodes
IV. With San Diego team help, set up a html webpage to view the across-technology benchmark (BM) results after completion of the BM simulations

Qualifications:
∙ A good understanding of semiconductor device physics or solid-state physics is a plus.
∙ Device compact modeling background is a strong plus.
∙ Familiar with device level Spice (Hspice/Spectre) simulation setup for DC, AC and RF.
∙ Familiar with one of the following programming/scripting languages: Python, C or Perl, familiar with html is a plus.
∙ Self-motivated, fast learner, hard-working and good team work skills.
∙ Good English speaking, and written communication skills.

12.Product & Test Engineering

Electrical Engineering/Computer Engineering

I. Focus on PRODUCT & TEST engineering, working closely with engineering teams.
II. Developing Digital, RF, Analog, Power Management Test solutions for QUALCOMM’s latest wireless chipsets.
III. Debugging and optimizing test solutions using ATE software tools Collection and analysis of test data using various software tools.
IV. Developing software scripts to improve engineering efficiencies.
V. Interviews are required; the good part is that successful performance during the internship period can lead to full-time employment offers.

Qualifications:
∙ Basic understanding of semiconductor physics and electronics. Programming skills in C++, Perl, and/or VBA are preferred. Training will be provided to all interns. 

13.Foundry Engineer

Electrical Engineering/Material Science/Physics/Equivalent Experience

Job responsibilities for this position include foundry process management, foundry wafer yield management, yield analysis, BKM management, KPI CPK management, lot handling.

Qualifications:
∙ Preferred candidate shall have expertise in areas of semiconductor process, semiconductor device, and statistical analysis. Knowledge of wafer probing, IC package, VBA and yield analysis tool is a plus.

Where mobility’s future intersects with yours.

You and mobile technology have something in common. You’re both going places that can change the world for the better and help bring the future here faster. And we think Qualcomm is the perfect place for you two to meet.

YoungTalent

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